Serving Electronic Packaging

Linde provides leading edge solutions in the form of nitrogen, hydrogen, argon, helium and other gas mixtures to the semiconductor wafer level packaging, assembly and test industries. Our gases are used in key processes such wafer thinning, wafer bumping, flip chip attach, soft solder die attach, copper wire bonding, cold test, storage and MEMS production. We also support special applications including:

  • Vacuum reflow in soft solder die void free attach.
  • Plasma reflow for flux-less micro bumping and flip chip attach.
  • Precision dry cleaning of submicron particles using CO2 by Eco-Snow Systems.

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Electronic packaging industry contact:

Mr. Teo Kok Whee
Telephone:  +65 6866 3133
Fax: +65 6866 3102
Email: KokWhee.Teo@boc.com