More Solutions for Electronic Packaging

Printed Circuit Board Assembly - Linde can help to improve your process yields in lead and lead-free soldering on rigid board and flex circuits by reducing defects such as misses, bridges and tombstoning, and reduce costs through flux savings, minimal dross formation and optimised process control. We provide value-add technical solutions that effectively reduce your Cost of Ownership (COO). We also support special applications including:

  • Lead-free soldering and retrofit wave machine to minimize dross
  • Lead free soldering and process auditing of reflow oven to optimize gas flow
  • Vacuum reflow soldering for void-free and flux-free power module assembly.

Passive Components - Linde gas solutions are frequently used in the manufacture of multi-layer chip capacitors (MLCC) for inerting during the high temperature firing of base metal internal and external electrodes in furnaces. Linde unique gas delivery solutions ensure even N2 blanket in the furnace critical zones resulting in high production yields with minimal gas wastage. Linde gases are also used in Quartz Crystals manufacturing.

Disk Media - Linde provide gas solutions for inerting as well as reactive special gases for media coating on both glass and Aluminium substrates. Our specially formulated gases are used in manufacturing of the industry latest Perpendicular Magnetic Recording (PMR) technology resulting in very high areal density disks.
Thermal Cycling of semiconductor packages and populated circuit boards such as ESS (environmental stress screen) and HALT (highly accelerated life testing) can be enhanced by the use of liquid nitrogen as a coolant. The low temperature of liquid nitrogen and its excellent thermal transfer properties enable rapid temperature cycling.

Dry Precision Cleaning - Linde’s Eco-Snow Systems (www.ecosnow.com) provide precision surface cleaning equipment and high purity CO2 in microelectronic dry cleaning applications. Eco-Snow Systems has an R&D clean room facility to conduct process qualification and testing for joint customer application development

Others - Linde gases are commonly used in many other areas of electronic packaging manufacturing processes for the purpose of inerting, reduction, reaction and thermal transfer. Contact your nearest Linde support office for a discussion.