Linde Electronics’ enhanced portfolio of gases and technical expertise to be unveiled at Semicon West
Acquisition of BOC creates a leading force in electronic gases
Murray Hill, New Jersey, U.S., July 10, 2007 – Semiconductor manufacturers who depend on a safe and reliable source of high quality electronic gases now have a supplier focused exclusively on developing solutions tailored to meet their unique requirements.
Linde Electronics, the global electronic gases business of The Linde Group, offers customers around the world an extensive selection of gases and related technical solutions to meet all of their needs, from research and development through to large-scale production. Linde AG acquired The BOC Group, PLC in 2006, creating one of the largest industrial gases and engineering companies in the world.
“We work with customers around the world to develop solutions that enable them to maximize safety, productivity and product quality by using gases more effectively,” said Noel Leeson, president of the Linde Electronics business.
Visit the Linde Electronics business team in booth #6460 at Semicon West in San Francisco’s Moscone Center July 17-19 to discuss in more detail how these capabilities can benefit semiconductor, electronic packaging, flat panel, and solar cell manufacturers. Customers can learn more about ways to lower operating costs by recycling xenon and to reduce greenhouse gas emissions by recovering and recycling chamber cleaning gases.
In the booth, Linde Electronics will feature its modular, onsite fluorine generating system, which enables manufacturers to produce high purity gas, supplied at low pressure.
“Fluorine is fast becoming manufacturers’ first choice for cleaning chemical vapor deposition (CVD) chambers in wafer manufacturing. In addition to having zero impact on global warming, fluorine enables manufacturers to clean chambers more quickly, which reduces downtime and improves fab productivity,” Leeson said.
In addition, Linde Electronics will feature its Flex-ALD™ range of precursor formulations for atomic layer deposition (ALD), which is used to make ultra-thin and conformal thin-film structures for advanced semiconductor device applications. Linde’s Flex-ALD formulations are designed to deposit very pure films and can reduce the cost and improve the efficiency of ALD processes by increasing precursor utilization, providing stable and consistent delivery without decomposition or condensation, and increasing film growth rates for higher tool throughput.
Company representatives also will be available at Semicon West to discuss dry, carbon dioxide based wafer cleaning tools and processes from Eco-Snow Systems, Inc., a division of BOC. These offerings include solid aerosol cleaning for removing ion-implanted photoresist and for removing particles generated by etching. Electronic packaging manufacturers can explore BOC’s solutions for void-free, lead-free and flux-less soldering, which help manufacturers boost product reliability and yield while improving environmental compliance.
The Linde Group is a world leading industrial gases and engineering group of companies with 49,000 employees working in around 70 countries worldwide. Following the acquisition of The BOC Group the company has gases and engineering sales of approximately 12 billion euros. The strategy of The Linde Group is geared towards forward-looking products and services.
For more information, please see The Linde Group online at http://www.linde.com
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