High Purity Bulk Atmospheric Gases

Argon (Ar)

Argon is widely used in a broad range of purging, annealing, sputtering, ion milling applications and as an inerting gas in silicon crystal pulling. Argon is also used in the emerging compound semiconductor industry. Argon systems can be designed for a wide range of flowrates, and with purity ranges from standard industrial grade to ultra-high purity.


Carbon Dioxide (CO2)

CO2 is used in the semiconductor industry for the oxidation of silicon. CO2 is also used for snow cleaning, a procedure which mechanically removes surface contamination by bombarding the surface to be cleaned with carbon dioxide snow. CO2 systems can be designed for a wide range of flowrates, and with purity ranges from standard industrial grade to ultra-high purity.

Additionally, Linde Electronics can provide proprietary onsite purification technology to provide for ultra-high purity super critical CO2.


Helium (He)

Helium is used in a broad range of purging, annealing, sputtering, leak checking and etching applications. Helium is also used for back side temperature control to maintain uniform and repeatable wafer temperature during critical deposition processes, such as WF6 chemical vapor deposition (CVD) and ion implantation. Helium systems can be designed for a wide range of flowrates, and with purity ranges from standard industrial grade to ultra-high purity.


Hydrogen (H2)

Hydrogen is used by the semiconductor industry as a reactant gas with trichlorosilane to form epitaxial silicon. Thermal oxides are grown using H2O produced from the combustion of high purity hydrogen and oxygen. Hydrogen is also used as a reducing gas to scavenge oxygen. Oxygen reduction prevents the formation of silicon dioxide as an impurity in the epitaxial silicon layer. Hydrogen is also used as a major component in doping gas mixtures employed in sensitive chemical vapor deposition (CVD) applications, as well as in many applications in compound semiconductor manufacture.

Hydrogen systems can be designed for a wide range of flowrates, and with purity ranges from standard industrial grade to ultra-high purity.


Nitrogen (N2)

Nitrogen is a carrier gas for bubblers. Bubblers are containers containing low pressures of volatile gases. Inert gas such as nitrogen is used to pressurize the container and force the volatile material out.

Nitrogen systems can be designed for a wide range of flowrates, and with purity ranges from standard industrial grade to ultra-high purity.


Oxygen (O2)

Ultra High purity oxygen is used by the semiconductor industry in a broad range of oxidation, plasma etching, and chemical vapor deposition (CVD) processes.

Oxygen systems can be designed for a wide range of flowrates, and with purity ranges from standard industrial grade to ultra-high purity.